MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound
Provide Permanent Protection For Your Equipment Against Impact, Moisture, and Harmful Chemicals
What's special about this epoxy?
- Perfect for high temperature environments or places with harmful chemicals.
- Bonds to a variety of materials, so it can be used in just about any application.
- When fully encapsulated, protects permanently against impact, shock, and moisture.
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This encapsulating epoxy provides the ultimate protection against heat and harsh environments. It has the ability to be potted, allowing you to fully encase your electronic devices and keep them safe in the container of your choice. It can be used on many materials, including glass, metal, ceramics and many plastics. Once cured, this epoxy provides permanent security for your devices, giving you long lasting protection for your valuable equipment. It can withstand extreme temperatures and is resistant to chemicals, submersion in water, acids, bases, fuels, and alcohols. It also becomes resistant to vibrations, abrasions and direct physical impact.
| Part # | Liquid Volume * | Weight | Price |
|---|---|---|---|
| MGC-832HT-375ML | 375ml (12 oz) | 1.2 lbs | Manufacturer Direct
|
* Liquid Volume is the total volume of Resin and Hardener combined.
MATERIAL SAFETY DATA SHEET -
| Cured Properties - Physical | Test Method | Result |
| Viscosity at 20 ºC (68 ºF) (Part A) | - | 54,800 cps |
| Viscosity at 20 ºC (68 ºF) (Part B) | - | 11,000 cps |
| Mixed Viscosity at 20 ºC (68 ºF) | - | 40,000 cps |
| Mixing Ratio by Volume | - | 2.0 : 1.0 (Part A: Part B) |
| Mixing Ratio by Mass | - | 2.186 : 1.000 (Part A: Part B) |
| Maximum Service Temperature | - | 275 ºC (527 ºF) |
| Maximum Intermittent Temperature | - | 300 ºC (572 ºF) |
| Working Time (100 gram sample) | - | 1 hour |
| Hardness, Shore D | - | 80 |
| Tensile Strength | ASTM-D-638-02A | 7,861 PSI |
| Elongation | ASTM-D-638-02A | 3.38% |
| Compressive Strength | ASTM-D-695-02A | 11,870 PSI |
| Flexural Strength | ASTM-D-790-03 | 14,600 PSI |
| Flexural Modulus | ASTM-D-790-03 | 399,000 PSI |
| Lap Shear Strength | ASTM-D-1002-01 | 1,794 PSI |
| Coefficient of Thermal Expansion | ASTM-D-648-01 | |
-40 ºC to 50 ºC |
- | 75.7x10-6 mm/mmºC |
+100 ºC to +250 ºC |
- | 154.0x10-6 mm/mmºC |
-40 ºCto +250 ºC |
- | 125.3x10-6 mm/mmºC |
+25 ºCto + 250 ºC |
- | 140.2x10-6 mm/mmºC |
| Deflection Temperature Under Load | ASTM-D-648-01 | 53.9 ºC (129.02 ºF) |
| Thermal Conductivity | ASTM-E-1530-99 | 0.210 W/mºK |
| Thermal Conductivity @ 25 ºC (77ºF) | ASTM-E-1461-92 | 0.218 W /mºK |
| Thermal Diffusivity @ 25 ºC (77 ºF) | ASTM-E-1461-92 | 1.33 x 10-13 M2/s |
| Specific Heat Capacity @ 25 ºC (77 ºF) | ASTM-E-1269-01 | 1419 J/kgºK |
| Curing Time (100g) | ||
@ room temp. |
- | 24 hours |
@65°C |
- | 60 minutes |
@80°C |
- | 45 minutes |
@100°C |
- | 35 minutes |
@130°C |
- | 25 minutes |
@160°C |
- | 15 minutes |
@200°C |
- | 10 minutes |
| Cured Properties - Electrical | Test Method | Result |
| Corrected Dissipation Factor, D |
ASTM-D-150-98 | 0.007 @ 1KHz |
| 0.011 @ 10KHz | ||
| 0.014 @ 100KHz | ||
| 0.014 @ 1MKHz | ||
| Dielectric Constant | ASTM-D-150-98 | 4.24 @ 60Hz |
| 2.96 @ 1KHz | ||
| 2.81 @ 10KHz | ||
| 2.83 @ 100KHz | ||
| 2.83 @ 1MKHz | ||
| Dissipation Factor | ASTM-D-150-98 | 0.0018 @ 60 Hz |
| Volume Resistivity | ASTM-D-257-99 | 9.3 x 1015 ohm · cm |
| Surface Resistivity | ASTM-D-257-99 | 5.3 x 1013 ohm |
| Dielectric Strength | ASTM D149-97a | 1,138 V/mill @ 0.020” |
| ASTM D149-97a | 326 V/mil @ 0.017” | |
| Breakdown Voltage | ASTM D149-97a | 54.4 kV |
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