MGC-832C (Clear) Epoxy Encapsulating and Potting Compound

Once Potted Your Board is Safe from Everything. Water, Chemical, Impact, even Eyesight if You Choose!


MGC-832C-375ML
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What's special about this epoxy?

  • Protects your printed circuit boards from moisture, shock, debris, and chemicals.
  • This is a non-conductive, low toxicity, highly impact resistant epoxy making it a great choice for your permanent potting needs.
  • Never comes off; once cured, this epoxy sticks forever so your electronic devices are protected.
  • Click for More Features

The clear epoxy leaves your PC Board open to viewing but still protected from harmful moisture, impact, dirt, debris, chemicals and anything else that might damage your electrical components.

Attention: Mixing ratio for this product is 2 parts A to 1 part of B. Please be advised that there is a misprint on the label for one of the production runs.

Part # Description Weight Price
MGC-832C-375ML Clear Encapsulating & Potting Compound 12oz 2 lbs
Qty:  
Manufacturer Direct
  • Very easy to use - just mix and pour
  • This epoxy compound can be cured on just an hour!
  • One year warranty
  • 832B - Part A (Resin)
    Hazards Identification:

    WHMIS Codes: D2B

    NFPA Ratings: Health 1; Flammability 0; Reactivity 0

    HMIS Ratings: Health 1; Flammability 0; Reactivity 0

    Eyes: Non-irritating.

    Skin: Prolonged exposure may cause skin irritation. May cause allergic reaction in some individuals.

    Inhalation: At room temperature, exposure to vapors is unlikely due to physical properties. Higher temperatures may generate vapor levels sufficient to cause irritation.

    Ingestion: Single dose oral toxicity is low. Amounts ingested incidental to industrial handling are not likely to cause injury; however, ingestion of large amounts may cause injury.

    Chronic: No information available.

    Fire Fighting Measures

    Auto ignition Temperature: n/e

    Flash Point: 190°C;

    LEL / UEL: n/e

    Exposure Control

    Routes of entry: Eyes, ingestion, inhalation, and skin.

    Ventilation: Use adequate general or local exhaust ventilation to keep airborne concentrations below exposure limits.

    Personal Protection: Wear appropriate protective eyeglasses or chemical safety goggles. Wear appropriate protective clothing to prevent skin contact. Use a NIOSH approved respirator when necessary.

    Physical and Chemical Properties

    Physical State: liquid

    Odor: odorless

    Solubility: none

    Evaporation Rate: n/e

    Boiling Point: n/e

    Specific Gravity: 1.13

    Vapor Pressure: n/e

    Vapor Density: 8.6 (Air=1)

    pH: n/a

    Stability and Reactivity

    Stability: Stable at normal temperatures and pressures.

    Conditions to avoid: n/a

    Incompatibilities: n/a

    Polymerization: Will not occur.

    Decomposition: Carbon dioxide, and carbon monoxide, phenolic compounds.

     
    832B - Part B (Hardener)
    Hazards Identification:

    WHMIS Codes: D2B

    NFPA Ratings: Health 1; Flammability 0; Reactivity 0

    HMIS Ratings: Health 1; Flammability 0; Reactivity 0

    Eyes: Causes severe eye irritation. May cause visual impairment.

    Skin: May cause skin irritation.

    Inhalation: May cause irritation of the upper respiratory tract.

    Ingestion: Relatively harmless. May cause gastrointestinal irritation, ulceration and or burns in the mouth and throat.

    Chronic: No information available.

    Fire Fighting Measures

    Auto ignition Temperature: n/e; Flash Point: 190°C; LEL / UEL: n/e

    Extinguishing Media: Use water spray, dry chemical, carbon dioxide, or chemical foam.

    General Information: n/a

    Exposure Control

    Routes of entry: Eyes, ingestion, inhalation, and skin.

    Ventilation: Use adequate general or local exhaust ventilation to keep airborne concentrations below exposure limits.

    Personal Protection: Wear appropriate protective eyeglasses or chemical safety goggles. Wear appropriate protective clothing to prevent skin contact. Use a NIOSH approved respirator when necessary.

    Physical and Chemical Properties

    Physical State: liquid

    Odor: ammonia

    Solubility: moderate

    Evaporation Rate: n/e

    Boiling Point: n/e

    Specific Gravity: 0.96

    Vapor Pressure: n/e

    Vapor Density: n/e

    pH: n/a

    Stability and Reactivity

    Stability: Stable at normal temperatures and pressures.

    Conditions to avoid: n/a

    Incompatibilities: Excessive heat.

    Polymerization: Will not occur.

    Decomposition: Unknown.

     

    832B Black Epoxy Encapsulating & Potting Compound Specifications   832C Clear Epoxy Encapsulating & Potting Compound Specifications
    Uncured Properties - Resin [Part A]
    Viscosity 2,500 cps
    Specific Gravity 1.1273
    Color Black
    Uncured Properties - Hardener [Part B]
    Viscosity 11,000 cps
    Specific Gravity 0.9564
    Color Clear, amber tint
    Cured Properties - PHYSICAL
    Mixed Viscosity 3,300 cps
    Mixed Specific Gravity 1.0577
    Volume Mix Ratio (resin:hardener) 2.0:1
    Mass Mix Ratio (resin:hardener) 2.3:1
    Shore Hardness 80 - 82 Shore D
    Tensile strength (ASTM D 638) 8475 psi
    Elongation 3.3%
    Compression strength (ASTM D 695) 14,675 psi
    Modulus 375,000 psi
    Flexural strength (ASTM D 790) 16,500 psi
    Modulus 427,000 psi
    Izod impact strength (ASTM D 256) 0.443 ft-lbs / inch notch 0.259" thick
    Lap Shear Strength (ASTM D 732) 957 psi
    Working time (100g) 60 min.
    Cure Time (100g, room temp.) 24 hours
    Heat Cure Time (100g, 65°C) 60 min.
    Cured Properties - TEMPERATURE
    Coefficient of Thermal Expansion (ASTM E 831) 0.036" / 10" @ 32°F, 0.013" / 10" @ 72°F
    Constant Service Temperature 140°C (284°F)
    Intermediate Service Temperature 145°C (293°F)
    Heat Deflection Temp. (264 psi) (ASTM D 648) 46.638°C (115.95°F)
    Cured Properties - ELECTRICAL
    Volume Resistivity (ASTM D 257) 3.1 x 1010 ohms
    Surface Resistivity (ASTM D 257) 5.3 x 1012 ohm · cm
    Dielectric Strength (0.124" thick)
    (ASTM D 149)
    402 V / mil, 60 Hz
    Dielectric Constant (ASTM D 150) 3.9 @ 60Hz
    Dissipation Factor 0.007 @ 23°C, 60Hz
    Insulative Yes
    Conductive No
    Chemical and Solvent Resistance
      Change after
    3 days
    Change after
    45 days
    Hydrochloric Acid < 0% < 1 %
    Isopropyl Alcohol < 0.3 % < 1 %
    Ethyl Lactate < 3 % < 7 %
    Acetone < 7% destroyed
    Xylene < 2% < 9 %
    Iso hexanes < 5 % < 8 %
    Mineral spirits < 0.3 % < 0.3 %
     
    Uncured Properties - Resin [Part A]
    Viscosity 2,500 cps
    Specific Gravity 1.1273
    Color Clear (yellow tint), colorless
    Uncured Properties - Hardener [Part B]
    Viscosity 11,000 cps
    Specific Gravity 0.9564
    Color Clear, amber tint
    Cured Properties - PHYSICAL
    Mixed Viscosity 3,300 cps
    Mixed Specific Gravity 1.0577
    Volume Mix Ratio (resin:hardener) 2.0:1
    Mass Mix Ratio (resin:hardener) 2.3:1
    Working time (100g) 60 min.
    Cure Time (100g, room temp.) 24 hours
    Heat Cure Time (100g, 65°C) 60 min.
    Tensile Elongation ASTM D 638 3276 psi / 6.4% elongation
    Compression Strength/modulus ASTM D 695 8971 psi/ 315000 psi
    Flexural strength/modulus ASTM D 790 5549 psi/ 370,000 psi
    Izod impact strength ASTM D 256 0.700 ft-lbs / inch notch, 0.214" thickness
    Shore Hardness ASTM D 2240 85 (initial) - 85 (10 sec) averages
    Coefficient of Thermal Expansion ASTM E 831 0.036" / 10 " @ 32°F; 0.020"/10" @72°F
    Lap shear strength ASTM 1002 702 psi
    Dielectric strength (0.114"thk) ASTM D 149 425 V / mil, 60 Hz
    Heat deflection temp. 264 psi ASTM D 648 43.548°C (92.22°F)
    Cured Properties - TEMPERATURE
    Constant Service Temperature 140°C (284°F)
    Intermediate Service Temperature 145°C (293°F)
    Cured Properties - ELECTRICAL
    Volume Resistivity (ASTM D 257) 1.22 x 10 ohm · cm
    Surface Resistivity (ASTM D 257) 5.50 x 1015 ohm · cm
    Dielectric Constant (ASTM D 150) 3.23 @ 60Hz; 3.19 @ 103 Hz; 2.99 @ 106 Hz
    Insulative Yes
    Conductive No
    Chemical and Solvent Resistance
      Change after 3 days Change after 45 days
    Hydrochloric Acid < 0% < 1 %
    Isopropyl Alcohol < 0.3 % < 1 %
    Ethyl Lactate < 3 % < 7 %
    Acetone < 7% destroyed
    Xylene < 2% < 9 %
    Iso hexanes < 5 % < 8 %
    Mineral spirits < 0.3 % < 0.3 %
    Manuals



     

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