MGC-832C (Clear) Epoxy Encapsulating and Potting Compound
Once Potted Your Board is Safe from Everything. Water, Chemical, Impact, even Eyesight if You Choose!
What's special about this epoxy?
- Protects your printed circuit boards from moisture, shock, debris, and chemicals.
- This is a non-conductive, low toxicity, highly impact resistant epoxy making it a great choice for your permanent potting needs.
- Never comes off; once cured, this epoxy sticks forever so your electronic devices are protected.
- Click for More Features
The clear epoxy leaves your PC Board open to viewing but still protected from harmful moisture, impact, dirt, debris, chemicals and anything else that might damage your electrical components.
Attention: Mixing ratio for this product is 2 parts A to 1 part of B. Please be advised that there is a misprint on the label for one of the production runs.
| Part # | Description | Weight | Price |
|---|---|---|---|
| MGC-832C-375ML | Clear Encapsulating & Potting Compound 12oz | 2 lbs | Manufacturer Direct
|
| 832B - Part A (Resin) | |
|---|---|
| Hazards Identification: |
WHMIS Codes: D2B NFPA Ratings: Health 1; Flammability 0; Reactivity 0 HMIS Ratings: Health 1; Flammability 0; Reactivity 0 Eyes: Non-irritating. Skin: Prolonged exposure may cause skin irritation. May cause allergic reaction in some individuals. Inhalation: At room temperature, exposure to vapors is unlikely due to physical properties. Higher temperatures may generate vapor levels sufficient to cause irritation. Ingestion: Single dose oral toxicity is low. Amounts ingested incidental to industrial handling are not likely to cause injury; however, ingestion of large amounts may cause injury. Chronic: No information available. |
| Fire Fighting Measures |
Auto ignition Temperature: n/e Flash Point: 190°C; LEL / UEL: n/e |
| Exposure Control |
Routes of entry: Eyes, ingestion, inhalation, and skin. Ventilation: Use adequate general or local exhaust ventilation to keep airborne concentrations below exposure limits. Personal Protection: Wear appropriate protective eyeglasses or chemical safety goggles. Wear appropriate protective clothing to prevent skin contact. Use a NIOSH approved respirator when necessary. |
| Physical and Chemical Properties |
Physical State: liquid Odor: odorless Solubility: none Evaporation Rate: n/e Boiling Point: n/e Specific Gravity: 1.13 Vapor Pressure: n/e Vapor Density: 8.6 (Air=1) pH: n/a |
| Stability and Reactivity |
Stability: Stable at normal temperatures and pressures. Conditions to avoid: n/a Incompatibilities: n/a Polymerization: Will not occur. Decomposition: Carbon dioxide, and carbon monoxide, phenolic compounds. |
| 832B - Part B (Hardener) | |
| Hazards Identification: |
WHMIS Codes: D2B NFPA Ratings: Health 1; Flammability 0; Reactivity 0 HMIS Ratings: Health 1; Flammability 0; Reactivity 0 Eyes: Causes severe eye irritation. May cause visual impairment. Skin: May cause skin irritation. Inhalation: May cause irritation of the upper respiratory tract. Ingestion: Relatively harmless. May cause gastrointestinal irritation, ulceration and or burns in the mouth and throat. Chronic: No information available. |
| Fire Fighting Measures |
Auto ignition Temperature: n/e; Flash Point: 190°C; LEL / UEL: n/e Extinguishing Media: Use water spray, dry chemical, carbon dioxide, or chemical foam. General Information: n/a |
| Exposure Control |
Routes of entry: Eyes, ingestion, inhalation, and skin. Ventilation: Use adequate general or local exhaust ventilation to keep airborne concentrations below exposure limits. Personal Protection: Wear appropriate protective eyeglasses or chemical safety goggles. Wear appropriate protective clothing to prevent skin contact. Use a NIOSH approved respirator when necessary. |
| Physical and Chemical Properties |
Physical State: liquid Odor: ammonia Solubility: moderate Evaporation Rate: n/e Boiling Point: n/e Specific Gravity: 0.96 Vapor Pressure: n/e Vapor Density: n/e pH: n/a |
| Stability and Reactivity |
Stability: Stable at normal temperatures and pressures. Conditions to avoid: n/a Incompatibilities: Excessive heat. Polymerization: Will not occur. Decomposition: Unknown. |
| 832B Black Epoxy Encapsulating & Potting Compound Specifications | 832C Clear Epoxy Encapsulating & Potting Compound Specifications | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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