MG Chemicals Lead-Free Solder with Silver
Greater Strength For Component Joining
MGC-4900-112G
What's special about this RoHS compliant solder?
- A 1lb spool has 27% more length than a leaded spool, which saves on labor and material costs
- Contains no-clean flux for easier cleanup after soldering
- Special flux activator is virtually spatter-free, keeping your application clean and free of stains
- 96.3% Tin, 0.7% Copper and 3% Silver (SAC 305)
- Click for More Features

This solder is perfect whether you need it for jewelry making, plumbing, electronics or any other craft or job that would need to affix to pieces of metal together. This formulation includes no lead for ultimate safety when used.
Part # | Description | Package Type | Weight | Price |
---|---|---|---|---|
MGC-4900-112G | Lead-Free Solder (96.3% Sn, 0.7% Cu, 0.3% Ag), 21 AWG, 0.032" diameter | Spool | 0.25 lb (113g) | Manufacturer Direct |
- Made up of 96.3% tin, 0.7% copper and 3% silver for use in a wide variety of applications like crafts, plumbing or circuit boards
- Lead-free
- 21 gauge (0.032") diameter will accommodate most jobs
- Hard, non-conductive residue will not create shorts when used on electronic components
- Includes silver for greater conductivity
- J-STD-006 and RoHS compliant for purity
Test Method | Specification | |
---|---|---|
Ag content | 2.8-3.2% | |
Cu content | 0.3-0.7 % | |
Sn content | Balance | |
Flux Classification | JSTD-004 | REL0 |
Copper Mirror | IPC-TM-650 2.3.32 | No removal of copper film |
Silver Chromate | IPC-TM-650 2.3.33 | Pass |
Corrosion | IPC-TM-650 2.6.15 | Pass |
SIR JSTD-004,Pattern Down | IPC-TM-650 2.6.3.3 | 2.33 x 10 11 ohms |
SIR Bellcore (Telecordia) | Bellcore GR-78-CORE 13.1.3 | 6.12 x 10 11 ohms |
Electromigration | Bellcore GR-78-CORE 13.1.4 | Pass |
Post Reflow Flux Residue | TGA Analysis | 55% |
Acid Value | IPC-TM-650 2.3.13 | 190-210 |
Flux Residue Dryness | IPC-TM-650 2.4.47 | Pass |
Spitting of Flux-Cored Solder | IPC-TM-650 2.4.48 | 0.3% |
Solder Spread | IPC-TM-650 2.4.46 | 130 mm2 |
Lead free/leaded solder comparison | Lead Free Solder (Sn/Ag/Cu) | Sn63/Pb37 (Leaded Solder) |
---|---|---|
Melting Point | 217-221 º C (422.6 - 429.8 º F) | 183 º C (361.4 º F) |
Wire Diameter | 0.032” (0.81 mm) | 0.032” (0.81 mm) |
Std. Wire Gauge | 21 | 21 |
Tolerance, in. | +/- 0.002” | +/- 0.002” |
Hardness, Brinell | 15HB | 14HB |
Coefficient of Thermal Expansion | Pure Sn=23.5 | 24.7 |
Tensile Strength | 4312 psi | 4442 psi |
Density | 7.39 g/cc | 8.42 g/cc |
Electrical Resistivity | 13.0 µohm-cm | 14.5 µohm-cm |
Electrical Conductivity | 16.6 %IACS | 11.9 %IACS |
Yield Strength, psi | 3724 | 3950 |
Total Elongation, % | 27 | 48 |
Joint Shear Strength, at 0.1mm/min 20º C | 17 | 14 |
Creep Strength, N/mm2 at 0.1mm/min 20º C | 13.0 | 3.3 |
Creep Strength, N/mm2 at 0.1mm/min 100° C | 5 | 1 |
Thermal Conductivity | 58.7 W/m * K | 50.9 W/m * K |
MANUALS & USER GUIDES -
RELATED ARTICLES -
- The Facts on American Wire Gauge (AWG)
- Key Elements for Cable Installation Success
- Smart Cable Management for School and Universities
Did you know that we can give you a quote for most of our products, including shipping?
You can also call us toll free 1-833-3CABLEORG (1-833-322-2536)>