MG Chemicals Lead-Free Solder with Silver

Greater Strength For Component Joining

MGC-4900-112G

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What's special about this RoHS compliant solder?

A 1lb spool has 27% more length than a leaded spool, which saves on labor and material costs
Contains no-clean flux for easier cleanup after soldering
Special flux activator is virtually spatter-free, keeping your application clean and free of stains
96.3% Tin, 0.7% Copper and 3% Silver (SAC 305)
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This solder is perfect whether you need it for jewelry making, plumbing, electronics or any other craft or job that would need to affix to pieces of metal together. This formulation includes no lead for ultimate safety when used.

Part #	Description	Package Type	Weight	Price
MGC-4900-112G	Lead-Free Solder (96.3% Sn, 0.7% Cu, 0.3% Ag), 21 AWG, 0.032" diameter	Spool	0.25 lb (113g)	Qty: Manufacturer Direct

Made up of 96.3% tin, 0.7% copper and 3% silver for use in a wide variety of applications like crafts, plumbing or circuit boards
Lead-free
21 gauge (0.032") diameter will accommodate most jobs
Hard, non-conductive residue will not create shorts when used on electronic components
Includes silver for greater conductivity
J-STD-006 and RoHS compliant for purity

	Test Method	Specification
Ag content		2.8-3.2%
Cu content		0.3-0.7 %
Sn content		Balance
Flux Classification	JSTD-004	REL0
Copper Mirror	IPC-TM-650 2.3.32	No removal of copper film
Silver Chromate	IPC-TM-650 2.3.33	Pass
Corrosion	IPC-TM-650 2.6.15	Pass
SIR JSTD-004,Pattern Down	IPC-TM-650 2.6.3.3	2.33 x 10 ¹¹ ohms
SIR Bellcore (Telecordia)	Bellcore GR-78-CORE 13.1.3	6.12 x 10 ¹¹ ohms
Electromigration	Bellcore GR-78-CORE 13.1.4	Pass
Post Reflow Flux Residue	TGA Analysis	55%
Acid Value	IPC-TM-650 2.3.13	190-210
Flux Residue Dryness	IPC-TM-650 2.4.47	Pass
Spitting of Flux-Cored Solder	IPC-TM-650 2.4.48	0.3%
Solder Spread	IPC-TM-650 2.4.46	130 mm²

Lead free/leaded solder comparison	Lead Free Solder (Sn/Ag/Cu)	Sn63/Pb37 (Leaded Solder)
Melting Point	217-221 º C (422.6 - 429.8 º F)	183 º C (361.4 º F)
Wire Diameter	0.032” (0.81 mm)	0.032” (0.81 mm)
Std. Wire Gauge	21	21
Tolerance, in.	+/- 0.002”	+/- 0.002”
Hardness, Brinell	15HB	14HB
Coefficient of Thermal Expansion	Pure Sn=23.5	24.7
Tensile Strength	4312 psi	4442 psi
Density	7.39 g/cc	8.42 g/cc
Electrical Resistivity	13.0 µohm-cm	14.5 µohm-cm
Electrical Conductivity	16.6 %IACS	11.9 %IACS
Yield Strength, psi	3724	3950
Total Elongation, %	27	48
Joint Shear Strength, at 0.1mm/min 20º C	17	14
Creep Strength, N/mm² at 0.1mm/min 20º C	13.0	3.3
Creep Strength, N/mm² at 0.1mm/min 100° C	5	1
Thermal Conductivity	58.7 W/m * K	50.9 W/m * K

MANUALS & USER GUIDES -

Lead-Free Solder with Silver MSDS (PDF)