MG Chemicals MGC-860 Silicone Heat Transfer Compound

Keep Heat From Damaging Your Valuable PC Boards


What's special about this silicone compound?

  • Transfers heat away from your electronic items such as: transistors, semi-conductors devices, ballasts (from simple to complex), and other electrical items to avoid damage and overheating.
  • Will not become brittle when it dries so that its high thermal conductivity remains strong.
  • High dielectric constant means your electronic component keeps its charge for longer periods of time.
  • Click for More Features

MGC-860 MG Chemicals Silicone Heat Transfer Compound is highly conductive and will not harden when it dries. It is made for transferring heat away from all types of electrical and electronic devices. Excellent for use with heat sinks, transistors, semi-conductors and more.

Part # Description Shipping Weight Price
MGC-860-60G 2oz MG Chemicals Silicone Heat Transfer Compound 0.7 lb
Manufacturer Direct
MGC-860-150G 5oz MG Chemicals Silicone Heat Transfer Compound 1.0 lb
Manufacturer Direct
  • When properly applied there are no gaps between the surfaces and good thermal conductivity is maintained.
  • Excellent for use with heat sinks, which will in turn protect your electronic from thermal damage.
  • One year manufacturer warranty
  • Material Safety Data Sheet (PDF) PDF
  •    Physical Properties
      Test Method Non Silicone
    Appearance Visual Off white / smooth paste White paste
    Consistency ASTM D 217 310-320  
    Specific Gravity
    @ 25°C (77°F)
      2.5 min 2.3 min
    Bleed %
    24 hours @ 200°C
    FTM-321 1.0% max 2.0% max
    Bleed %
    24 hours @ 200°C
    FTM-321 1.0% max 2.0% max
    24 hours @ 200°C
    ASTM D-566 > 500°F (260°C)  
    Max. operating temp.   200°C 200°C (consistent)
    300°C intermittent
       Electrical Properties
      Test Method Non Silicone
    Thermal Conductivity Hot Wire Method Heat Flow #36 °C 18.48 x 10-4 (K Factor, Cal/Sec cm•K) 0.657 W/m•K
    Dielectric Strength
    (0.05l gap)
    ASTM D-149 350 V/MIL 400 V/MIL
    Dielectric Constant @ 1000 Hz ASTM D- 150 4.4 3.81
    Dissipation Factor
    @ 1000 Hz
    ASTM D 150 0.0021 0.0032
    Resistivity @ 21°C ASTM D 150 6.38 x 1013 Ohm/cm 1.5 x 1015 Ohm/cm


    Hazards Identification
    WHMIS Codes D2B
    NFPA Ratings Health 1  Flammability 0  Reactivity 0
    HMIS Ratings Health 1  Flammability 0  Reactivity 0
    Eyes Causes moderate eye irritation
    Skin May cause mild skin irritation
    Inhalation Possible dust hazard if particles are separated from the polymeric matrix
    Ingestion None Known
    Chronic None Known
    Fire Fighting Measures
    Auto-ignition Temperature N/E
    Flash Point 260° C
    LEL / UEL N/A
    Extinguishing Media All standard extinguishing media
    General Information Will burn if involved in a fire
    Exposure Controls
    Routes of Entry Eyes, ingestion, inhalation, and skin
    Ventilation Not required
    Personal Protection Wear appropriate protective eyeglasses or chemical safety goggles. Wear appropriate protective clothing to prevent skin contact.
    Physical and Chemical Properties
    Physical State Paste
    Odor Odorless
    Solubility Insoluble
    Evaporation Rate N/A
    Boiling Point 300° C
    Specific Gravity 2.4
    Vapor Pressure N/A
    Vapor Density N/A
    pH N/A
    Stability and Reactivity
    Stability Stable at normal temperatures and pressures
    Conditions to avoid Incompatible substances
    Incompatibilities Oxidizing agents
    Polymerization Will not occur
    Decomposition Carbon monoxide, carbon dioxide, silicone dioxide, formaldehyde
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