MG Chemicals MGC-860 Silicone Heat Transfer Compound
Keep Heat From Damaging Your Valuable PC Boards
MGC-860-60G
What's special about this silicone compound?
- Transfers heat away from your electronic items such as: transistors, semi-conductors devices, ballasts (from simple to complex), and other electrical items to avoid damage and overheating.
- Will not become brittle when it dries so that its high thermal conductivity remains strong.
- High dielectric constant means your electronic component keeps its charge for longer periods of time.
- Click for More Features
MGC-860 MG Chemicals Silicone Heat Transfer Compound is highly conductive and will not harden when it dries. It is made for transferring heat away from all types of electrical and electronic devices. Excellent for use with heat sinks, transistors, semi-conductors and more.
| Part # | Description | Shipping Weight | Price |
|---|---|---|---|
| MGC-860-60G | 2oz MG Chemicals Silicone Heat Transfer Compound | 0.7 lb | Manufacturer Direct
|
| MGC-860-150G | 5oz MG Chemicals Silicone Heat Transfer Compound | 1.0 lb | Manufacturer Direct
|
| Physical Properties | |||
| Test Method | Non Silicone 8610 |
Silicone 860 |
|
| Appearance | Visual | Off white / smooth paste | White paste |
|---|---|---|---|
| Consistency | ASTM D 217 | 310-320 | |
| Specific Gravity @ 25°C (77°F) |
2.5 min | 2.3 min | |
| Bleed % 24 hours @ 200°C |
FTM-321 | 1.0% max | 2.0% max |
| Bleed % 24 hours @ 200°C |
FTM-321 | 1.0% max | 2.0% max |
| Evaporation 24 hours @ 200°C |
ASTM D-566 | > 500°F (260°C) | |
| Max. operating temp. | 200°C | 200°C (consistent) 300°C intermittent |
|
| Electrical Properties | |||
| Test Method | Non Silicone 8610 |
Silicone 860 |
|
| Thermal Conductivity | Hot Wire Method Heat Flow #36 °C | 18.48 x 10-4 (K Factor, Cal/Sec cm•K) | 0.657 W/m•K |
| Dielectric Strength (0.05l gap) |
ASTM D-149 | 350 V/MIL | 400 V/MIL |
| Dielectric Constant @ 1000 Hz | ASTM D- 150 | 4.4 | 3.81 |
| Dissipation Factor @ 1000 Hz |
ASTM D 150 | 0.0021 | 0.0032 |
| Resistivity @ 21°C | ASTM D 150 | 6.38 x 1013 Ohm/cm | 1.5 x 1015 Ohm/cm |
| Hazards Identification | |
| WHMIS Codes | D2B |
|---|---|
| NFPA Ratings | Health 1 Flammability 0 Reactivity 0 |
| HMIS Ratings | Health 1 Flammability 0 Reactivity 0 |
| Eyes | Causes moderate eye irritation |
| Skin | May cause mild skin irritation |
| Inhalation | Possible dust hazard if particles are separated from the polymeric matrix |
| Ingestion | None Known |
| Chronic | None Known |
| Fire Fighting Measures | |
| Auto-ignition Temperature | N/E |
| Flash Point | 260° C |
| LEL / UEL | N/A |
| Extinguishing Media | All standard extinguishing media |
| General Information | Will burn if involved in a fire |
| Exposure Controls | |
| Routes of Entry | Eyes, ingestion, inhalation, and skin |
| Ventilation | Not required |
| Personal Protection | Wear appropriate protective eyeglasses or chemical safety goggles. Wear appropriate protective clothing to prevent skin contact. |
| Physical and Chemical Properties | |
| Physical State | Paste |
| Odor | Odorless |
| Solubility | Insoluble |
| Evaporation Rate | N/A |
| Boiling Point | 300° C |
| Specific Gravity | 2.4 |
| Vapor Pressure | N/A |
| Vapor Density | N/A |
| pH | N/A |
| Stability and Reactivity | |
| Stability | Stable at normal temperatures and pressures |
| Conditions to avoid | Incompatible substances |
| Incompatibilities | Oxidizing agents |
| Polymerization | Will not occur |
| Decomposition | Carbon monoxide, carbon dioxide, silicone dioxide, formaldehyde |
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