MG Chemicals Thermally Conductive Epoxy Encapsulating & Potting Compound

Secure Your Components Against Moisture and Corrosion


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What's special about this epoxy?

  • Once cured, this epoxy provides permanent protection to your circuit board for long lasting protection
  • Prevents short circuits caused by moisture or corrosion
  • Enables heat to dissipate evenly and prevent components from overheating
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Moisture and humidity can be extremely harmful to electronic devices that are not protected. MG Chemicals has created an epoxy that shields against this damage, and protects against corrosion. It also protects against impact, shock, conductivity, chemicals, and accidental drops and falls.
This 2-part encapsulating compound is mixed and then poured directly onto the circuit board. It is black in color, and is used to encase boards with components that give off heat. It not only protects against moisture and humidity, but enables heat dissipation as well.


MGC-832TC-450ML 450 ml (16 oz) 2 lbs Black DISCONTINUED
MGC-832TC-40L 40 L (10 gal) 156 lbs Black DISCONTINUED

* Liquid Volume is the total volume of Resin and Hardener combined.


  • Contains a form of nylon, making components extremely impact resistant
  • When fully encapsulated, protects against chemicals, impact, shock, drops and falls
  • Nonporous, water and chemical resistant for long lasting security to devices
  • Easy to mix, 2 part mixture is simple to apply and use
  • RoHS compliant, ensuring the user’s safety from harmful materials
  • Long pot life, giving you even more protection




Cured Properties - PHYSICAL   Test Method
Mixed Viscosity 76,300 cps -
Mixed Specific Gravity 1.6156 -
Volume Mix Ratio (resin:hardener) 1:01 -
Working time (100g) 120 min. -
Cure Time (100g, room temp.) 48 hours -
Heat Cure Time (100g, 65°C) 60 min. -
Shore Hardness 82 Shore D -
Tensile strength 2734 psi ASTM-D-638-02A
Elongation 1.87% ASTM-D-638-02A
Compressive Strength 4,088 psi ASTM-D-695-02A
Flexural Strength 5,352 psi ASTM-D-790-03
Cantilever Beam (IZOD) Impact 0.80 ft lb ft / in ASTM-D-256-02 E1
Shear Strength 3.224 psi ASTM-E-831-03
Cured Properties - TEMPERATURE   Test Method
Constant Service Temperature 90°C (194°F) -
Heat Deflection Temperature 35.35°C (95.6°F) ASTM-D-648-01
Dielectric Constant 4.41 ASTM-D-150-98
Dissipation Factor   ASTM-D-150-98
Volume Resistivity 2.58 x 10 15 ohm · cm ASTM-D-257-99
Surface Resistivity 3.16 x 10 16 ohm · cm ASTM-D-257-99
Heat Deflection Temperature 35.35°C (95.6°F) ASTM-D-648-01
Intermediate Service Temp. 110°C (230°F) -
Thermal Conductivity 0.682 W/m*K -
Thermal Diffusivity 0.38 mm 2 /s -
Volumetric Specific Heat 1.9MJ/m 3 *K -
Thermal Expansion 148.3x10 -6 mm/mm°C ASTM-E-831-03
Chemical and Solvent Resistance Change after 3 days:  
Hydrocloric Acid < 0.50% -
Isopropyl Alcohol ~ 0% -
Ethyl Lactate < 1 % -
Acetone < 3% -
Xylene < 2% -
Iso hexanes ~ 0% -
Mineral spirits ~ 0% -


Uncured Properties - Resin [Part A]
Viscosity 41,100 cps
Specific Gravity 1.8019
Color Black
Uncured Properties - Hardener [Part B]
Viscosity 68,900 cps
Specific Gravity 1.5036
Color Black







832B epoxy encapsulating and potting compoundMG Chemicals 832B & 832C Epoxy Encapsulating and Potting Compound
This epoxy comes in two colors, black and clear. The black epoxy will protect not only the PC board but your proprietary information as well. No one will be able to see your board under the black protective coating. The clear epoxy leaves your PC Board open to viewing but still protected from harmful moisture, impact, dirt, debris, chemicals and anything else that might damage your electrical components.
heat transfer compoundSilicone Heat Transfer Compound - MGC-860
MGC-860 MG Chemicals Silicone Heat Transfer Compound is highly conductive and will not harden when it dries. It is made for transferring heat away from all types of electrical and electronic devices. Excellent for use with heat sinks, transistors, semi-conductors and more.
Klein tools Work GlovesDeerskin Work Gloves
Premium deerskin, soft and form-fitting for maximum comfort. Gunn cut with seams away from wear surfaces. Inseam index finger. Sheep-like pile lining.

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