MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound

Provide Permanent Protection For Your Equipment Against Impact, Moisture, and Harmful Chemicals

Low Price Guarantee Scroll To Pricing

What's special about this epoxy?

  • Perfect for high temperature environments or places with harmful chemicals
  • Bonds to a variety of materials, so it can be used in just about any application
  • When fully encapsulated, protects permanently against impact, shock, and moisture
  • Click for More Features
RoHS Compliant

This encapsulating epoxy provides the ultimate protection against heat and harsh environments. It has the ability to be potted, allowing you to fully encase your electronic devices and keep them safe in the container of your choice. It can be used on many materials, including glass, metal, ceramics and many plastics. Once cured, this epoxy provides permanent security for your devices, giving you long lasting protection for your valuable equipment. It can withstand extreme temperatures and is resistant to chemicals, submersion in water, acids, bases, fuels, and alcohols. It also becomes resistant to vibrations, abrasions and direct physical impact.

Images

PART # Liquid Volume * WEIGHT PRICE
MGC-832HT-375ML 375ml (12 oz) 1.2 lbs
Qty:  
MGC-832HT-3L 3L (0.8 gal) 8 lbs
Qty:  

* Liquid Volume is the total volume of Resin and Hardener combined.

  • Prevents short circuits caused by moisture or corrosion
  • Simple, easy to mix 2 part mixture is ready for use in just minutes
  • RoHS compliant, ensuring the user’s safety from harmful materials
  • Protects up to temperatures of 527°F (275°C)
  • Long pot life, to keep your devices secure in their designated container

 

MATERIAL SAFETY DATA SHEET-

 

Cured Properties - Physical Test Method Result
Viscosity at 20 ºC (68 ºF) (Part A) - 54,800 cps
Viscosity at 20 ºC (68 ºF) (Part B) - 11,000 cps
Mixed Viscosity at 20 ºC (68 ºF) - 40,000 cps
Mixing Ratio by Volume - 2.0 : 1.0
(Part A: Part B)
Mixing Ratio by Mass - 2.186 : 1.000
(Part A: Part B)
Maximum Service Temperature - 275 ºC (527 ºF)
Maximum Intermittent Temperature - 300 ºC (572 ºF)
Working Time (100 gram sample) - 1 hour
Hardness, Shore D - 80
Tensile Strength ASTM-D-638-02A 7,861 PSI
Elongation ASTM-D-638-02A 3.38%
Compressive Strength ASTM-D-695-02A 11,870 PSI
Flexural Strength ASTM-D-790-03 14,600 PSI
Flexural Modulus ASTM-D-790-03 399,000 PSI
Lap Shear Strength ASTM-D-1002-01 1,794 PSI
Coefficient of Thermal Expansion ASTM-D-648-01  
-40 ºC to 50 ºC
- 75.7x10-6 mm/mmºC
+100 ºC to +250 ºC
- 154.0x10-6 mm/mmºC
-40 ºCto +250 ºC
- 125.3x10-6 mm/mmºC
+25 ºCto + 250 ºC
- 140.2x10-6 mm/mmºC
Deflection Temperature Under Load ASTM-D-648-01 53.9 ºC (129.02 ºF)
Thermal Conductivity ASTM-E-1530-99 0.210 W/mºK
Thermal Conductivity @ 25 ºC (77ºF) ASTM-E-1461-92 0.218 W /mºK
Thermal Diffusivity @ 25 ºC (77 ºF) ASTM-E-1461-92 1.33 x 10-13 M2/s
Specific Heat Capacity @ 25 ºC (77 ºF) ASTM-E-1269-01 1419 J/kgºK
Curing Time (100g)
@ room temp.
- 24 hours
@65°C
- 60 minutes
@80°C
- 45 minutes
@100°C
- 35 minutes
@130°C
- 25 minutes
@160°C
- 15 minutes
@200°C
- 10 minutes

 

Cured Properties - Electrical Test Method Result
Corrected Dissipation
Factor, D
ASTM-D-150-98 0.007 @ 1KHz
0.011 @ 10KHz
0.014 @ 100KHz
0.014 @ 1MKHz
Dielectric Constant ASTM-D-150-98 4.24 @ 60Hz
2.96 @ 1KHz
2.81 @ 10KHz
2.83 @ 100KHz
2.83 @ 1MKHz
Dissipation Factor ASTM-D-150-98 0.0018 @ 60 Hz
Volume Resistivity ASTM-D-257-99 9.3 x 1015 ohm · cm
Surface Resistivity ASTM-D-257-99 5.3 x 1013 ohm
Dielectric Strength ASTM D149-97a 1,138 V/mill @ 0.020”
ASTM D149-97a 326 V/mil @ 0.017”
Breakdown Voltage ASTM D149-97a 54.4 kV

MANUALS & USER GUIDES -

 

MATERIAL SAFETY DATA SHEET-

 

VIEW OUR GLOSSARY

 

832B epoxy encapsulating and potting compoundMG Chemicals 832B & 832C Epoxy Encapsulating and Potting Compound
From
This epoxy comes in two colors, black and clear. The black epoxy will protect not only the PC board but your proprietary information as well. No one will be able to see your board under the black protective coating. The clear epoxy leaves your PC Board open to viewing but still protected from harmful moisture, impact, dirt, debris, chemicals and anything else that might damage your electrical components.

MG Chemicals Thermally Epoxy Encapsulating, Potting compoundMG Chemicals Thermally Conductive Epoxy Encapsulating & Potting Compound
From
Formulated to completely encapsulate sensitive components, this potting compound makes circuit boards resistant to impact, water, and chemicals, and helps to dissipate heat.

 
Klein tools Work GlovesDeerskin Work Gloves
Price
Premium deerskin, soft and form-fitting for maximum comfort. Gunn cut with seams away from wear surfaces. Inseam index finger. Sheep-like pile lining.
 

Do you have any question about this product?
Let our experts and customers resolve all your doubts

Did you know that we can give you a quote for most of our products, including shipping?


You can also call us toll free 866.222.0030

What can make this page better?

We do everything we can think of to provide you with the product specs, images and ordering info you need, but if we're missing something or still have room to improve, please let us know. Your comments, suggestions and questions are the best tools we have for serving you better!