MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound

Provide Permanent Protection For Your Equipment Against Impact, Moisture, and Harmful Chemicals

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What's special about this epoxy?

  • Perfect for high temperature environments or places with harmful chemicals
  • Bonds to a variety of materials, so it can be used in just about any application
  • When fully encapsulated, protects permanently against impact, shock, and moisture
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RoHS Compliant

This encapsulating epoxy provides the ultimate protection against heat and harsh environments. It has the ability to be potted, allowing you to fully encase your electronic devices and keep them safe in the container of your choice. It can be used on many materials, including glass, metal, ceramics and many plastics. Once cured, this epoxy provides permanent security for your devices, giving you long lasting protection for your valuable equipment. It can withstand extreme temperatures and is resistant to chemicals, submersion in water, acids, bases, fuels, and alcohols. It also becomes resistant to vibrations, abrasions and direct physical impact.

PART # Liquid Volume * WEIGHT PRICE
MGC-832HT-375ML 375ml (12 oz) 1.2 lbs

* Liquid Volume is the total volume of Resin and Hardener combined.

  • Prevents short circuits caused by moisture or corrosion
  • Simple, easy to mix 2 part mixture is ready for use in just minutes
  • RoHS compliant, ensuring the user’s safety from harmful materials
  • Protects up to temperatures of 527°F (275°C)
  • Long pot life, to keep your devices secure in their designated container




Cured Properties - Physical Test Method Result
Viscosity at 20 ºC (68 ºF) (Part A) - 54,800 cps
Viscosity at 20 ºC (68 ºF) (Part B) - 11,000 cps
Mixed Viscosity at 20 ºC (68 ºF) - 40,000 cps
Mixing Ratio by Volume - 2.0 : 1.0
(Part A: Part B)
Mixing Ratio by Mass - 2.186 : 1.000
(Part A: Part B)
Maximum Service Temperature - 275 ºC (527 ºF)
Maximum Intermittent Temperature - 300 ºC (572 ºF)
Working Time (100 gram sample) - 1 hour
Hardness, Shore D - 80
Tensile Strength ASTM-D-638-02A 7,861 PSI
Elongation ASTM-D-638-02A 3.38%
Compressive Strength ASTM-D-695-02A 11,870 PSI
Flexural Strength ASTM-D-790-03 14,600 PSI
Flexural Modulus ASTM-D-790-03 399,000 PSI
Lap Shear Strength ASTM-D-1002-01 1,794 PSI
Coefficient of Thermal Expansion ASTM-D-648-01  
-40 ºC to 50 ºC
- 75.7x10-6 mm/mmºC
+100 ºC to +250 ºC
- 154.0x10-6 mm/mmºC
-40 ºCto +250 ºC
- 125.3x10-6 mm/mmºC
+25 ºCto + 250 ºC
- 140.2x10-6 mm/mmºC
Deflection Temperature Under Load ASTM-D-648-01 53.9 ºC (129.02 ºF)
Thermal Conductivity ASTM-E-1530-99 0.210 W/mºK
Thermal Conductivity @ 25 ºC (77ºF) ASTM-E-1461-92 0.218 W /mºK
Thermal Diffusivity @ 25 ºC (77 ºF) ASTM-E-1461-92 1.33 x 10-13 M2/s
Specific Heat Capacity @ 25 ºC (77 ºF) ASTM-E-1269-01 1419 J/kgºK
Curing Time (100g)
@ room temp.
- 24 hours
- 60 minutes
- 45 minutes
- 35 minutes
- 25 minutes
- 15 minutes
- 10 minutes


Cured Properties - Electrical Test Method Result
Corrected Dissipation
Factor, D
ASTM-D-150-98 0.007 @ 1KHz
0.011 @ 10KHz
0.014 @ 100KHz
0.014 @ 1MKHz
Dielectric Constant ASTM-D-150-98 4.24 @ 60Hz
2.96 @ 1KHz
2.81 @ 10KHz
2.83 @ 100KHz
2.83 @ 1MKHz
Dissipation Factor ASTM-D-150-98 0.0018 @ 60 Hz
Volume Resistivity ASTM-D-257-99 9.3 x 1015 ohm · cm
Surface Resistivity ASTM-D-257-99 5.3 x 1013 ohm
Dielectric Strength ASTM D149-97a 1,138 V/mill @ 0.020”
ASTM D149-97a 326 V/mil @ 0.017”
Breakdown Voltage ASTM D149-97a 54.4 kV







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